The PiezoMEMS market is experiencing a surge, projected to grow at a 6% CAGR. This growth is driven by the adoption of piezoelectric thin film deposition technology across 10 product categories, including microspeakers, microphones, MEMS oscillators, autofocus, and micro-cooling. The market's resurgence comes after a slowdown in the past two years due to global economic challenges. Piezoelectricity, a phenomenon known for nearly a century, relies on a select few materials that can be effectively scaled to semiconductor processes. These materials, such as Thin-film PZT, AlN, and Sc-doped AlN, offer distinct properties that define performance for specific applications. For instance, thin-film AlN deposition is more suited for sensing applications, while thin-film PZT contributes primarily to actuating properties. Foundries have developed expertise in piezoelectric deposition, and manufacturers are leveraging partnerships and innovative business models to reduce development timelines, accelerate market entry, and broaden the adoption of piezoMEMS solutions. Yole's Oleksil Bratash highlights the convergence of proven materials science and advanced semiconductor manufacturing in piezoMEMS, leading to rapid product proliferation and diverse applications, from audio components to next-generation sensing platforms. Devices include microspeakers, voice accelerometers, microphones, ultrasonic sensors, and MEMS autofocus for lenses. MEMS microspeakers from xMEMS and USound are being integrated into consumer devices like the Singularity ONI, SoundPEATS Capsule3 Pro+, and Soranik Hearing’s MEMS-3S earbuds. Voice accelerometers and microphones from Qualcomm, integrated into Technics earbuds, Misfit smartwatches, and Arlo cameras, showcase the technology's versatility. Ultrasonic and optical devices, including TDK’s CH-101 range sensors and poLight ASA’s TLens autofocus lens, are embedded in AR/VR devices such as the Magic Leap 2 and HTC Vive Focus Plus. The performance and costs of these devices are shaped by differences in MEMS processes, packaging, ASIC nodes, and structural designs, allowing manufacturers to differentiate their products in a competitive market. Scanning Electron Microscopy (SEM) and Energy Dispersive X-ray (EDX) techniques have been employed to analyze the piezoelectric layers of examined devices, along with material characteristics, deposition technique, and thickness, providing valuable insights into the innovation and value creation within the supply chain.
